High Performance Thermal Compound for the Enthusiast.
MX-2 is a high thermal conductivity and low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal conductivity is a major factor.
- High Thermal Conductivity.
- Low Thermal Resistance.
- Non-Electrical Conductive.
- Non-Capacitive.
- Non-Curing.
- Non-Corrosive.
- No Bleeding.
- Odorless.
Safe to apply anywhere.
Since the MX-2 does not contain any metal particles, there are no problems regarding electrical conductivity or capacitance. Unlike other silver and copper compounds, MX-2 ensures that contact to electrical traces, pins and leads cannot result in any damage.
Durability.
With MX-2 no curing and no bleeding of the compound are possible. In contrast to other products, this compound does not show decreasing performance over time, does not need to be reapplied and has a durability of at least 8 years.
MX-2 is a high thermal conductivity and low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal conductivity is a major factor.
- High Thermal Conductivity.
- Low Thermal Resistance.
- Non-Electrical Conductive.
- Non-Capacitive.
- Non-Curing.
- Non-Corrosive.
- No Bleeding.
- Odorless.
Safe to apply anywhere.
Since the MX-2 does not contain any metal particles, there are no problems regarding electrical conductivity or capacitance. Unlike other silver and copper compounds, MX-2 ensures that contact to electrical traces, pins and leads cannot result in any damage.
Durability.
With MX-2 no curing and no bleeding of the compound are possible. In contrast to other products, this compound does not show decreasing performance over time, does not need to be reapplied and has a durability of at least 8 years.
Specificaties |
Viscositeit | 850 |
Constitutief bestanddeel | Carbon | |
Thermische geleidbaarheid | 5.6 W/m·K | |
Dichtheid | 3.96 | |
Aantal | 1 | |
Niet-capacitief | Ja | |
Niet-geleidend | Ja | |
RoHS volgzaamheid | Ja | |
Gewicht en omvang |
Gewicht | 4 g |
Verpakking |
Breedte verpakking | 82 mm |
Diepte verpakking | 15 mm | |
Hoogte verpakking | 172 mm | |
Gewicht verpakking | 11 g |